Remote Locations: Static models are usually situated remotely, escalating Price and reducing Total procedure performance.
thirty% of its peak ability use, offering our buyers significant reduction in working costs and increased dependability.
the knowledge underneath is categorized by semiconductor method and Software maker. Each individual table includes an Applications Matrix that shows qulified and industrial procedures.
initially Started in 1985, our business has grown right into a regarded chief in supplying temperature Handle methods to the worldwide semiconductor sector.
This impressive technique, providing a little variety aspect, low priced-of-Ownership and Dynamic Temperature Management presented course of action and devices engineers a different Device to optimize their temperature delicate procedures.
The precision from the POU 3300 allows for independent control of the method fluid temperature towards the wafer chuck within just +/- 0.1 °C of set place, and also the speedy response time of your method will allow for optimum wafer-to-wafer repeatability all through the etch system.
The precision on the POU 3500 permits impartial control of the process fluid temperature to your wafer chuck in just +/- 0.one °C of established place, along with the quick reaction time of the technique makes it possible for for optimum wafer-to-wafer repeatability through the entire etch approach.
With our unit strategically mounted around six feet within the chamber, we accomplish a much more exact examining on the chuck temperature. This approach ensures consistent temperature all over the creation lot, leading to enhanced wafer-to-wafer CD uniformity.
The data pertains to some 300mm chamber temperature profile in the course of a superior aspect ratio Etch process, running at really significant RF power problems (~3.8kW). The powerful elements of this information established are:
LAUDA-Noah is Assembly these new issues and has website integrated Strength saving technological innovation in systems which have been welcoming to your atmosphere and also have a affordable to operate.
the info established here is from a 200mm volume production wafer fab and Evidently illustrates the benefit of the LAUDA-Noah POU process.
The POU3300 technique features dynamic temperature control of the process chamber cathode / electrode / anode and may be synchronized with any etch system.
The reality is real Dynamic Temperature Management can only be achieved when all 5 (five) of the subsequent system structure and set up specifications are achieved:
(hence, installing a static device close to chamber will likely not help it to deliver dynamic temperature Handle)
We demand a lot less cooling/heating capability for the same software like a static TCU as a consequence of our smaller reservoir quantity.